Used EBARA EPO-2228 #293658079 for sale

EBARA EPO-2228 is a state-of-the-art wafer grinding, lapping and polishing equipment designed to provide superior surface finishing in a production environment. This system is capable of producing highly accurate, fine-tolerance surfaces on both single and double-sided wafers. The unit consists of a highly efficient grinding and lapping machine, as well as a precision polishing head for the application of final finishes. The grinding machine features a vertically oriented table and built-in grinding wheel; it is capable of producing flat, ground surfaces with high precision and repeatability. The lapping machine houses two flat, independently controlled lapping plates; this ensures the formation of a perfectly parallel, flat surface on the wafer. The machine's polishing head is capable of providing a highly polished surface finish; the head is mounted on a rotary table to allow for the application of fine polishing across the entire wafer. A powerful vacuum tool ensures efficient removal of polishing residuals. The entire asset is driven by custom software, allowing for fully automated and precise grinding, lapping and polishing cycles. The level of automation offered by this model is unparalleled; the equipment is capable of automatically detecting surface flaws and air bubbles to ensure perfect results. EBARA EPO2228 is designed to provide maximum rate of production with minimal human intervention. The system's narrow profile is ideal for integrating into existing production lines, and its efficiency and reliability make it the ideal choice for a wide range of wafer finishing applications. This unit promises to deliver superior results in terms of wafer surface finish with maximum speed and minimal human interference.