Used EBARA EPO-2228 #9203972 for sale

EBARA EPO-2228
ID: 9203972
Wafer Size: 8"
Vintage: 1998
CMP System, 8" 1998 vintage.
EBARA EPO-2228 Wafer Grinding, Lapping and Polishing equipment is an advanced, automated solution for precision surface finishing of semiconductor, electronic and optical materials. The system is capable of manufacturing and testing a wide range of advanced devices, from high-precision MEMS components to ultra-high-density optical waveguides. At the core of EBARA EPO2228 is a pair of high-performance spindle motors and associated drive unit that produce ultra-precise, programmable grinding, lapping, and polishing operations with a level of accuracy that is critical in many high-end applications. The motors are mated to high-strength materials such as carbide and diamond, allowing the spindle to easily handle the most difficult material types such as high-temperature alloys and hard ceramic. The machine is equipped with a number of advanced programmable features, allowing for repeatable single-step operations, batch production runs and automated testing sequences. The software supports the use of custom workholding fixtures, allowing for flexible and repeatable operation. This allows operators to quickly establish process set points and repeat these precise settings when switching from one material type to another. EPO 2228 machine is also equipped with an intelligent error-recovery feature that can automatically recall the last-validated grinding, lapping and polishing program in the event of an unexpected process interruption. This feature helps speed up production by allowing the tool to instantly resume the process without waiting for someone to intervene. The asset is also capable of precise in-process measurement to ensure the integrity of the process and insuring a level of accuracy that meets customer requirements. The embedded monitoring features are also capable of alerting operators of a problem before the material is further processed, allowing immediate corrective action to be taken. EPO2228 Wafer Grinding, Lapping and Polishing model is an exceptionally precise and automated solution for manufacturing and testing demanding materials. This combination of unparalleled accuracy and automated process control allows for greater yields and cost-savings, all while ensuring a reliable, high-quality product.
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