Used EBARA EPO-2228D #293642832 for sale

EBARA EPO-2228D is a precision wafer grinding, lapping and polishing equipment designed to achieve the highest level of flatness, surface finish, and edge accuracy in advanced applications. EPO-2228D is capable of processing wafers up to 8-inch in diameter, and offers a variety of features and options to accommodate a variety of user requirements. The system includes two-axis motorized wafer carpenter chucks for precise wheel alignment and repeatable wheel patterns, and two-axis motorized polishing spindle for fast and accurate wheel dressing. A variable speed drive and manual wheel control allows for precisely controlled wheel speed, and a variable height wheel tray holds up to two motorized or manual wheels. The unit also includes a manual wheelhead for hand-polishing small and hard-to-reach areas. The machine is easy to use, with a user-friendly touch screen controller and onboard diagnostics. The automated conveyor tool makes for efficient material loading and unloading, and a low-pressure air exhaust asset allows for superior air filtration and control. The model also features built-in safety features, including a barcode reader, a toolbox door interlock, automated interlock sequencing, and emergency stop buttons to help ensure safe use of the machine. The equipment is designed to deliver the highest levels of accuracy and reliability, making it suitable for a wide range of wafer processing applications. It is capable of achieving high levels of surface finish and flatness, as well as excellent edge accuracy. The system is designed to reduce cycle times and maximize throughput by providing high grinding speeds and fast process control times. EBARA EPO-2228D unit can be equipped with a variety of options, including multiple grinding wheels, a spraymate processing machine, a wafer process monitor and thermal control tool, and a variety of vacuum and liquid feed systems. The asset is also highly flexible, and can be configured to fit many customer specifications and requirements. EPO-2228D is the perfect solution for wafer grinding, lapping and polishing. It is designed to deliver high levels of accuracy and reliability, providing excellent levels of surface finish, flatness, and edge accuracy for a wide range of semiconductor and other manufacturing applications.