Used EBARA EPO-222A #293622939 for sale

EBARA EPO-222A is a wafer grinding, lapping and polishing equipment for producing high-precision surfaces in all types of semiconductor wafers, such as silicon, gallium nitride (GaN) and quartz. Its advanced grinding, lapping and polishing technologies leverage dynamic control that ensures optimized surface qualities, resulting in improved yield and process efficiency. This system is designed to create high-accuracy, mirror-like surfaces on wafers. It features a two-step grinding process that utilizes abrasive wheel grinding technology, followed by substrate lapping, wafer non-contact polishing and dual wool polishing. The unit's grinder is equipped with a hollow roller type head, designed to uniformly deliver the material to the peripheral edge of the wheel, thus producing an even grind on the surface. Additionally, the lapping spindle operates at high rotational speeds to deliver highly uniform and repeatable surfaces. The heavy load polishing machine supplies the required pressure and controllable slip for uniform material removal rates. EBARA EPO 222A is equipped with a computer tool for operating and controlling the various processes, allowing for adjustments as needed to produce high-precision surfaces. Its user-friendly touch-screen monitor; design also allows for easy operation. Furthermore, it has been designed to minimize waste and reduce maintenance time by including an auto-adjustment feature that optimizes grinding pressure and interval times. Moreover, this asset is built for reliability and sustainability, with backup components for emergency breakdown or maintenance. EPO 222 A includes 9 liners, 10 abrasive wheels and 13 lapping plates. It features integrated safety features, such as a lower pressure warning model. It also contains a dust collection equipment that improves the work environment by capturing any airborne dust particles. In conclusion, EBARA EPO 222 A is a highly accurate and robust wafer grinding, lapping and polishing system that is essential for producing high-precision surfaces in many semiconductor wafers. Its sophisticated grinding, lapping and polishing technologies, integrated safety features and user-friendly design provide improved efficiency, productivity, and cost-savings.