Used EBARA EPO-222A #293809677 for sale

EBARA EPO-222A is a precision wafer grinding, lapping and polishing equipment designed for ultra-high accuracy, repeatable polishing of semiconductor and optical components. The system provides multiple nested head pieces to allow for high throughput from start to finish with the highest precision for each step. The main unit of EBARA EPO 222A is a high power servomotor driven head, mounted on a cantilevered arm, that is capable of speeds up to 3000 RPM. The head features an adjustable angle of attack and has an adjustable automatic speed control. Two additional head pieces, the front lapping head and the rear grinding head, are designed to be rapidly changed and recalibrated. The lapping head features two independent motors which provide a uniform polishing action; the grinding head provides an aggressive grinding profile. Both the lapping and grinding heads feature diamond abrasive polishers as standard, with tungsten carbide polishers available as optional accessories. EPO 222 A is equipped with a durable construction and an integrated vacuum unit, allowing for efficient and effective tool cleaning. The machine has a closed loop quality control tool, enabling consistent, repeatable performance and adjustable end point control. EPO 222A also features a built-in intelligent process control module to provide accurate, real-time data on the wafer's progression and an on-board diagnostics asset which enables quick and accurate trouble-shooting. A pre-programmed recipe library and a graphical user interface provide an intuitive experience for the operator. The model is low maintenance and easy to operate, featuring a plug-and-play design and minimal downtime for set-up and reconfiguration. The equipment features both analog and digital interfaces for connectivity and data exchange, enabling maximum integration with other systems, while ensuring complete traceability of process adjustments and full operation monitoring. EPO-222A is ideal for single- and multi-machine applications such as production wafer processing, thin-film device fabrication, and semiconductor packaging and optical device assembly. It is suitable for a variety of materials, such as SiC, SiO, GaAs, and SOI. With its integrated system design, efficient production process capabilities, and reliable performance, EBARA EPO 222 A is an ideal choice for customers in the market for a reliable and precise wafer grinding, lapping and polishing unit.