Used EBARA EPO-222A #9188685 for sale

ID: 9188685
Wafer Size: 8"
Vintage: 2000
CMP System, 8" 2000 vintage.
EBARA EPO-222A Wafer Grinding, Lapping & Polishing Equipment is a precision radial lapping and polishing system designed to finish precise flat, spherical, and cylindrical surfaces. This is achieved by utilizing modular lapping tools that are easily interchangeable for different grinding and polishing applications. EBARA advanced lapping technology makes EBARA EPO 222A the perfect choice for production, engineering research and development, and semiconductor processing. EPO 222 A is a fully automated machine with a number of features designed for high-precision results. It utilizes a rotary motion to enable grinding and polishing up to five times faster than traditional methods. Its variable speed spindle gives the unit the necessary speed and accuracy to achieve ISO 9001 requirements. The advanced lapping technology used in EPO 222A allows for full control of the lapping process. The machine is able to precisely adjust the lapping pressure as well as the contact time to achieve the desired level of surface finish. Additionally, EBARA EPO 222 A has an ultrasonic sensing module that monitors the temperature of the lapping tools, which allows for constant precision results. EPO-222A is equipped with a digital display panel that allows users to easily monitor the status and operation of the tool. EBARA EPO-222A also includes a number of asset-safety features that minimize the risk of accidental injury or damage to the model and its components. These safety features include emergency switches, automatic shut off, manual ports, and safety shut off to detect any malfunctions or damaged parts. Additionally, EBARA EPO 222A offers numerous customization options, including water-cooling, multiple lapping plates, and changable spindle speeds. Combined with EBARA advanced lapping technology, users are sure to get the desired outcome from their lapping and polishing processes. EPO 222 A is an ideal choice for any user looking for a reliable, efficient, and precise method of grinding and polishing. With its advanced lapping technology, high-precision results, and numerous customization options, this equipment is up to any challenge.
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