Used EBARA EPO-222A #9293809 for sale

EBARA EPO-222A Wafer Grinding, Lapping & Polishing Equipment is an advanced and precise lapping and polishing system designed to provide precision and repeatability in semiconductor manufacturing. This unit utilizes an advanced two-station rotary table with up to four independent grinding, polishing, and lapping heads working at the same time for maximum process efficiency and throughput. It has a robust, mounted base that contains up to eight pieces of wafers. EBARA EPO 222A Wafer Grinding, Lapping & Polishing Machine features an advanced programming GUI for controlling all the machine's parameters, including feed rate, pressure, and process time. This ensures that the user will always get the desired results with each run. Furthermore, the tool offers a quick setup time for the user so they can begin their run in minutes. EPO 222 A has an advanced diamond squeegee that applies precise and uniform pressure over the entire process wafer, eliminating scratching and distortion. The machine can process wafers up to 200mm or 8.0in in diameter. Its advanced ACE Holographic Interferometry asset ensures that the lapped wafer is free of defect. EPO 222A utilizes a combination of liquid diamond, oil, and abrasives for finishing wafers. This allows the machine to provide high surfaces finishes and excellent edge preparation. Also, the model can control the individual feed rates for grinding, polishing, and lapping, giving the user total control over their process. EBARA EPO 222 A provides an exceptionally wide array of safety features. This includes a built-in safe loading and unloading station, as well as incorporation of a vacuum equipment that eliminates all chances of contamination from grinding and lapping dust. Furthermore, the system's active safety unit continuously monitors the entire machine, meaning that any hazardous or unexpected circumstances will immediately be detected and taken care of. In conclusion, EPO-222A Wafer Grinding, Lapping & Polishing Tool is a reliable and precise machine that incorporates user-friendly programming and advanced safety features. It provides uniform finish and edge preparation with minimal risk of defect and contamination. The fact that it requires very minimal setup time is a huge benefit to any user as well. Overall, it's an ideal machine to produce high-quality wafers for semiconductor manufacturing.