Used EBARA EPO-222A #9396292 for sale

EBARA EPO-222A is a state-of-the-art wafer grinding, lapping, and polishing equipment, designed to provide unmatched accuracy and yield in the production of precision wafers. The system is designed for maximum ease of use and includes a 21-inch precision grinding head with variable speed control and rubber backing disk. The grinding head is capable of achieving a grinding speed of 20 microns per second, making it ideal for even the most intricate wafer fabrication processes. The unit also includes a multi-step cartridge lapping process, designed to achieve a complete lapping consistency and uniformity even on the most intricate wafers. EBARA EPO 222A includes a diamond-tipped lapping head with adjustable speed and constant pressure lapping capabilities, to ensure uniform lapping of the entire wafer. A rubbing ring ensures complete lapping edges evenly and accurately. The polishing head includes an adjustable speed and tilt, to accommodate different types of wafers, ensuring complete uniformity of finish. EPO 222 A is powered by a three-phase, 2.2 kW motor, capable of producing up to 3300 rpm. The machine also includes a precision-machined cooling fan, to ensure the complete and uniform cooling of the entire tool. A precision-machined rinse station ensures efficient and uniform rinse-down of the entire work area. The asset is designed for superior safety with multiple emergency stops. It also includes a precision-machined feeder with an ergonomic load arm and counterbalance, to allow for smooth and controlled handling and transport of the wafers throughout the process. The model is capable of producing high-precision wafers up to 80 μm in thickness, making it ideal for a variety of applications, from semiconductor to medical device fabrication. EPO-222A equipment is the perfect choice for any company or research facilities seeking a robust system with superior features and specifications.