Used EBARA EPO-222D #293669538 for sale
URL successfully copied!
Tap to zoom
EBARA EPO-222D is a high-precision, multi-functional wafer grinding, lapping and polishing equipment. It is precision-engineered to bring out the highest possible levels of accuracy and reliability in the grinding, lapping and polishing of semiconductor wafers. Combining advanced technologies of vacuum processing with exceptionally efficient and stable ultra-precision machining, EPO-222D offers the highest level of performance available. EBARA EPO-222D features a powerful grinding spindle with an output power of 180 W. This spindle is capable of grinding silicon semiconductor wafers up to a diameter of 200 mm with a speed up to 30,000 rpm. The spindle has display-controlled rotation for displaying the speed control. The spindle also allows for the selection of wheel replacement or frequency conversion based on the needs of the intended processes. EPO-222D also includes a vacuum chuck table and a high-precision flat lapping table. The chuck table features a precision-machined surface which enables a uniform, repeatable grinding and lapping process. The vacuum chuck table also enables the grinding of flat silicon wafers without the need for extra cushioning or a flattening mechanism. The lapping table is designed to provide ultra-smooth and glossy surface finishes on the wafers. EBARA EPO-222D also features an advanced control system which allows for precise control and automatic measurement of grinding milling process parameters, such as depth, speed, and surface quality. This unit also allows users to minimize the risk of oxidation and heat damage to the wafers during the grinding and lapping processes. In addition, EPO-222D is equipped with an impressive dust collection machine that can help protect the polishing tools and the working environment from dust particles. The dust collection tool is made highly efficient by the use of special filters and a powerful fan. Further, the innovative dust traps are designed to separate the stone powder dust from the wafer particles and light plastic dust, thereby preventing dust outlet. EBARA EPO-222D is a powerful and reliable wafer grinding, lapping and polishing asset that is designed to produce high-quality lapping on a variety of semiconductor materials and sizes. Featuring advanced technologies and a highly efficient and stable grinding spindle, EPO-222D is capable of delivering extremely precise results in a short amount of time. Combined with its superior control model and advanced dust collection equipment, EBARA EPO-222D is an ideal option for any wafer grinding, lapping and polishing needs.
There are no reviews yet