Used EBARA EPO-222T #293662648 for sale
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EBARA EPO-222T is an advanced wafer grinding, lapping, and polishing equipment designed for use with semiconductor and other non-metal substrates. This system features a robust and reliable design that allows for consistent and high-quality results. The unit is tailored to handle substrates of different sizes and thicknesses and can be used for a variety of operations including wafer thinning, polishing, surface grinding, and edge grinding. The machine consists of a main two-axis adjustable table and a three-axis robotic arm. The two-axis adjustable table can be used to position the substrates and move them around in the workspace, as well as to tilt and optimize the polishing/grinding operation. The robotic arm can be used to handle substrates of up to 200mm in diameter and allows for accurate and repeatable movement of the substrates within the workspace. EBARA EPO222T also features a coolant tool, which supplies coolant to the grinding and polishing wheels to better manage the heat generated during the operation. Additionally, the asset can be outfitted with air knives for optimal cooling and increased disk life. EPO 222T is equipped with two sets of grinding/polishing tools, each of which can be used to perform different types of operations depending on the application. The first set includes diamond grinding wheel, diamond lapping disc and polishing pad for variable speed operation. The second set of tools is composed of a grinding wheel, lapping disc and polishing pad for high quality polishing operations. The tools are designed to grind and polish a variety of substrates, such as quartz, silicon, and GaAs. The model is also equipped with a highly reliable safety and protection equipment. This system includes a moving safety guard, interlocks, and emergency stop buttons which are designed to ensure the safe operation of the unit. Additionally, EBARA EPO 222T is designed to meet international safety standards such as, CE, RoHS, and WEEE. EPO222T is an incredibly versatile and reliable wafer grinding, lapping, and polishing machine. This tool has a robust and heavy-duty design, allowing it to perform consistent and reliable operations on a variety of semiconductor and non-metal substrates. The asset is equipped with two sets of grinding/polishing tools, a coolant model, and a safety equipment, allowing for optimal grinding and polishing operations with the utmost safety and reliability.
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