Used EBARA EPO-222T #9226873 for sale

EBARA EPO-222T is a wafer grinding, lapping, and polishing equipment designed for the preparation of high Yield Silicon Electronically via a chemical mechanical polishing (CMP) process. It is capable of processing up to 3" wafers with a minimum die pitch of 3 microns. This system is equipped with advanced polishing capabilities, such as programmable down force, process pressure control, and force correction. EBARA EPO222T has an integrated touch screen controller with touch sensitive LCD interface and data acquisition software for general unit performance monitoring, collection of real-time process data, and recording of all related data to ensure the integrity and validity of the polishing process. EPO 222T features an 8-inch diameter, dual-axis rotary wafer chucking stage with 5-axis motion platform, allowing for controllable force/transverse velocity and precise spatial positioning of the wafer surface. It also includes a set of wafer slider stages, which can process up to 15 wafers in a single run. The wafer slider assembly ensures even force distribution across the wafer radius while preventing die-to-die interference. An integrated turntable is provided to ensure uniform polishing results in the wafer-to-wafer direction. The machine includes two polishing heads which can be independently operated for simultaneous dual-axis surface rotation. The polishing head's design incorporates a floating-type star structure and air bearing technology, allowing for a precisely controlled contact pressure across the whole surface for optimal material removal. The star rings incorporate a set of radial dams for independent pneumatic control of the inner and outer rings, thereby providing additional flexibility in polishing conditions. EPO222T is equipped with an advanced in-process monitoring tool (IPM) and closed-loop control of the polishing process, providing excellent profile data and high-end process results. The IPM uses an alignment laser to measure the center coordinates of the wafer's position and monitor polishing concentricity. A closed-loop control asset allows for precise force regulation and programmable process conditions with adjustable polishing cycles and pressure curves. This model is equipped with a fluid delivery equipment that allows for a wide variety of slurry types to be used, ensuring flexibility and a repeatable process. Additionally, a safety protection system is included, featuring software and hardware safeguards such as limit switches, photo sensors, and overload protection. Overall, EBARA EPO 222T is an advanced wafer grinding, lapping, and polishing unit that provides superior quality results for the IC manufacturing industry. It is capable of ultra-precise wafer processing and its versatile range of settings make it ideal for use in both high production and R&D settings, making it a reliable and cost-effective solution for semiconductor IC fabrication.