Used EBARA EPO-222T #9238850 for sale

EBARA EPO-222T is a high-performance wafer grinding, lapping, and polishing equipment that delivers superior results with each application. This machine is designed for use with processes that involve precision grinding, lapping, and polishing of silicon wafers. The system can be applied to a wide range of substrates including Si, SiC, and GaN. EBARA EPO222T features a multi-stepping design that gives it the ability to process wafers of different diameters, thicknesses, and materials with an efficient, repeatable finish. It is composed of a main housing frame with a base mounted four-axis CNC controller, grinding/lapping head, and various peripheral subsystems. The grinding/lapping head consists of a heavy-duty spindle with adjustable speed and feed, allowing the user to fine-tune the grinding/lapping process according to the application. This unit boasts a low-noise operating environment, allowing for noise protection up to 95 dB(A). To reduce vibration, an auxiliary outboard spindle drive is employed. It also features a high-intensity lighting machine, enabling users to observe their processes accurately and in detail. In addition, a set of safety guards are provided to ensure maximum operational safety. EPO 222T is equipped with a centrifugal polishing wheel that is capable of achieving a polished finish on the wafers in a single pass. Its full-auto polishing mode offers advanced features such as adjustable spin speed, adjustable rotational speed, and adjustable polishing pressure to help users achieve the highest final polish quality. The tool is easy to use, fast, and efficient. It can be operated manually or programed with a variety of parameters to suit each user's unique application needs. Finally, the entire asset is housed in a small enclosed dampening cover, with an optional vacuum dust collection unit to minimize dust dispersal.