Used EBARA EPO-222T #9357639 for sale

EBARA EPO-222T is a wafer grinding, lapping, and polishing equipment designed for fabricating and repairing advanced substrates. It features a rotary spindle system to maximize grinding, lapping, and polishing accuracy and efficiency, with an accuracy of ±5µm and a resolution of 0.01µm. The unit is capable of processing wafers up to 8 inch diameter with step heights up to 0.5 mm. EBARA EPO222T features a high-quality spindle design that maintains a stable rotation speed of 0-1,000 rpm. Its six-axis, CNC-controlled configuration allows for easy installation of lapping tools for precise grinding, lapping, and polishing processes. The machine also features an additional axis of free movement to enable quick, easy, and accurate wafer positioning. The tool is comprised of a direct-drive motor, an AC frequency inverter for fine motor-speed control, a Z-axis actuator, an spindle head, an indexing chuck, and a polishing fixture. The highly adaptable asset is capable of multiple grinding and polishing conditions based on the user's process requirements. The spindle head is designed with a rotary encoder for feedback control, allowing for constant speed and torque control. This ensures that the wafers are uniformly ground and polished to the highest possible accuracy and surface quality. The indexing chuck is equipped with an optical encoder and a precision-machined cam profile for quick and efficient loading and unloading of wafers. It also allows for fast and accurate lapping tool, abrasive belt, and roller changing. The polishing fixture is designed with a ferromagnetic design allowing it to secure the wafer onto a rotatable table. This ensures that the wafer is securely held in place during grinding and polishing processes for optimal results. In addition to its simple, yet user-friendly design, the model is designed for superior accuracy and repeatability. It also features advanced safety features, such as an emergency stop switch and a magnetic braking equipment to ensure safety during operation. EPO 222T is an advanced wafer grinding, lapping, and polishing system that is ideal for producing and repairing advanced substrates. It features robust spindle design and up to seven axes of motion to maximize accuracy and efficiency. Its safety features make it a reliable tool to ensure product reliability and performance. The high quality of this unit makes it an ideal choice for fabricating and repairing advanced substrates.