Used EBARA EPO-222T #9398270 for sale

EBARA EPO-222T
ID: 9398270
Wafer Size: 12"
Vintage: 2004
CMP System, 12" 2004 vintage.
EBARA EPO-222T is an advanced ultra-precision grinding, lapping and polishing equipment designed for use in the semiconductor industry. It is capable of producing ultra-smooth surfaces with nanoscale accuracy, at rates up to five times faster than conventional grinding and polishing systems. The system is highly automated, featuring an integrated wafer loader and unloader and an array of advanced image processing capabilities, making it an ideal choice for producing high-quality wafers with ultimate levels of accuracy and reliability. The unit utilizes electro-polishing and mechanical abrading technologies. A rotating crucible is used to hold the wafer for grinding and lapping, and the abrasive media is fed directly into the grinding chamber, where it is mixed with a small amount of water and precisely dispensed onto the surface of the wafer. The instrument then performs electro-polishing, which uses electrical current and the abrasive medium to rapidly remove material from the wafer surface. The machine's integrated image processing functions are used to ensure micro-level control of the grinding, lapping and polishing process by monitoring the surface of the wafer as it is polished. The image processing tool is capable of detecting even the smallest defects and irregularities on the wafer surface, enabling the user to make corrections as needed to produce the desired finish. EBARA EPO222T also features a variety of automated safety features, such as the ability to detect chamber overfills and the presence of foreign objects. It is designed to operate with both CMP (Chemical Mechanical Polishing) and traditional grinding and polishing methods, making it an ideal choice for businesses striving for the highest levels of accuracy and precision. Overall, EPO 222T is a powerful and reliable wafer grinding, lapping and polishing asset that is capable of producing exceptionally smooth and uniform surfaces with nanoscale accuracy. Its integrated automation and advanced imaging processing capabilities make it an excellent choice for businesses that require highly accurate surfaces in a short amount of time.
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