Used EBARA EPO-222T #9412401 for sale

EBARA EPO-222T is a highly advanced wafer grinding, lapping, and polishing equipment designed for optimal production efficiency and superior product quality. This cost-effective system features state-of-the-art waveform-generating controls, leading-edge grinding technology, and dual-axis spindle control for precision machining. The unit offers high-speed processing capability and automated grinding and polishing for a wide variety of semiconductor and microelectronics application. The components of EBARA EPO222T include a fully enclosed, pre-engineered process chamber with a full-width, 3-foot long processing chamber and a top-loading, robotic work area for safe and efficient operation. The machine also features a three-axis motion control tool with a combination of two high-torque synchronous motors and a servo motor, providing superior accuracy, repeatability, and high-speed operation. An advanced grinding spindle design delivers precise control of feed rates and speeds with a high-powered motor that ensures smooth, consistent surface finish performance. An easy to use touchscreen interface and intuitive graphical programming software allow operators to quickly set up their process parameters and adjust their machining parameters with the push of a button. An advanced tool alignment asset ensures superior results with minimal operator intervention. EPO 222T also features an automated safety model featuring safety mats, light curtains, an operator interlock, and a constant down look capability for clean and safe operation. The equipment is fully integrated with an automated data collection system, enabling operators to store and monitor their process data for further analysis. The unit also features a self-regulating retraction machine which can be quickly and securely clamped, locked and aligned for optimum performance. Finally, the tool features an advanced dust-collection asset which features HEPA filtration and remote monitoring for increased safety. The advanced features, robust construction, and intuitive user interface of EBARA EPO 222T make it the perfect solution for grinding, lapping, and polishing in a wide variety of semiconductor and microelectronics applications. This cost-effective, reliable model delivers superior results with minimal operator intervention; ensuring accurate, repeatable and high-quality results.