Used EBARA EPO-223 #293636272 for sale

EBARA EPO-223
ID: 293636272
CMP system.
EBARA EPO-223 is a professional-grade, automated wafer grinding, lapping and polishing equipment. The design of the system is fully automated to allow the user to quickly and easily perform the entire wafer production process. The unit uses a precision-controlled, high-speed spindle to grind, lap and polish wafers with a diameter up to 300 mm. The machine features a robot wafer loader and cassette positioner, which help reduce cycle time. The lap plate's size and rotational speed can be adjusted with the help of an intuitive touchscreen interface to ensure greater accuracy for different applications and materials. Additionally, the tool is equipped with advanced safety features, such as an emergency stop switch, light curtains and interlocks that ensure the safety of the operator. The design of the asset also incorporates dedicated dust control features to keep the environment within optimal cleanroom specifications. For grinding, the model is fitted with a 3-axis spindle that is programmed to profile wafers on its own. The spindle is driven by a high-torque motor, allowing it to achieve speeds up to 22,000 rpm. The grinding heads are adjustable to cater for various wafer sizes, materials and process requirements. The spindle is also equipped with an accelerometer-based speed control equipment, further enhancing the precision of the grinding process. EPO-223's design also enables users to effectively and quickly lap wafers. The system utilises an ultra-precision air bearing to control the rotation of the lap table and carriage with a high level of accuracy. The lap table is built to be powered pneumatically and is designed with a vacuum cup pump to help keep wafers securely in place during lapping. Additionally, the lap plate can be adjusted to ensure optimum results for different materials. The polishing process is handled through the unit's automated polishing head. The polishing head features adjustable polishing pads designed to handle any wafer size from 3 to 300 mm. The machine also incorporates a 6-axis robot arm and a polishing machine for uniformity control, helping ensure a consistent polishing finish. The robot arm is also fitted with a digitally-controlled end effector, which helps to automate the process and reduce cycle times. EBARA EPO-223 is built with premium-grade materials and components to provide superior performance and reliability. The tool is compliant with CE, UL, and ESD certifications, guaranteeing that it is safe to use. Furthermore, EPO-223 is backed by a comprehensive warranty, ensuring long-term peace of mind.
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