Used EBARA EPO-223 #9293810 for sale

EBARA EPO-223
ID: 9293810
Wafer Size: 8"
Vintage: 1997
System, 8" 1997 vintage.
EBARA EPO-223 is a wafer grinding, lapping, and polishing equipment designed to meet the needs of modern semiconductor production. A precision milling and finishing system, EPO-223 efficiently and accurately produces and shapes a variety of surfaces on ultrafine workpieces with a rigorous process. The unit has a four-axis configuration consisting of a workpiece spindle, XYZ-table, and wafer grind spindle. It is also outfitted with a newly designed wafer polishing machine head and integrated dust collecting machine, allowing for a clean and efficient work flow. In addition to these components, the tool includes several accessories, such as an inspection microscope, which allows for accurate surface measurements. The combination of these components and accessories is designed to process wafers quickly and efficiently. EBARA EPO-223's high-speed spindle allows for a rapid cutting speed which enables processing of a wide range of substrates and materials. In terms of grinding, it provides a exceptional surface quality with no marks or scratches. Its lapping process is capable of achieving excellent flatness and good topography. Finally, the polishing aspect of the asset produces a mirror-like finish and outstanding surface quality, making it suitable for a variety of different applications. Before the new upgraded EPO-223, previous wafer grinding processes often produced unsatisfactory results due to inadequate methods and equipment. EBARA EPO-223, however, on its improved design and automation inherited from EBARA existing GUBE-223 model offers quicker and more efficient wafer production. The model also reduces the amount of dust generated during the process, which contributes to a cleaner and healthier working environment. Overall, the breadth of the features and capabilities of EPO-223 makes it an ideal choice for companies or organizations looking for an efficient and accurate solution for their wafer grinding, lapping, and polishing needs. Its advanced technology, automated processes, and user-friendly interface make it a necessary product for any modern semiconductor production line.
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