Used EBARA EPO-223 #9394796 for sale

EBARA EPO-223
ID: 9394796
Wafer Size: 8"
Vintage: 1997
CMP systems, 8" 1997 vintage.
EBARA EPO-223 is a state-of-the-art wafer grinding, lapping, and polishing equipment that is designed to offer superior precision when shaping and finishing wafers made of semiconductors and other materials. This system is ideal for applications that require a high level of accuracy and repeatability. EPO-223 is a two-axis grinding, lapping, and polishing unit with the capability to tilt and rotate each of its two axes independently of the other. This capability enables the machine to accurately finish wafers in a variety of shapes and angles. It also allows for the tool to quickly and easily be set up for different applications. EBARA EPO-223 features a two-stage grinding wheel that is suitable for a variety of materials, allowing it to be used for a wide range of wafer finishing tasks. The lapping and polishing stages are each driven by a separate motor, enabling EPO-223 to provide a high degree of control over each step of the process. EBARA EPO-223 is a full-featured asset, featuring an integrated safety model that includes emergency stop switches and cutting-edge digital control panels - giving operators ultimate control over the grinding, lapping, and polishing process. EPO-223 also has a dedicated control panel for each axis which can be set up and programmed to execute a variety of grinding routines for unique wafer shapes and sizes. EBARA EPO-223's digital control panels also feature an array of pre-programmed settings and adjustments to help users get up and running quickly and to ensure repeatable results over the long term. EPO-223 includes diagnostic features and includes both remote and local diagnostic capabilities, allowing users to detect and troubleshoot any potential problems quickly. The unit is available in various configurations, offering the flexibility to meet any of the customers' needs. EBARA EPO-223 is a cryogenically cooled grinding, lapping, and polishing equipment that is designed to offer superior precision when shaping and finishing wafers made of semiconductors and other materials. This system is the ideal choice for many different applications - with its reliable, robust design, integrated safety systems, and digital control panels.
There are no reviews yet