Used EBARA Frex 200 #293819847 for sale

EBARA Frex 200 is a versatile wafer grinding, lapping, and polishing equipment designed for superior wafer processing rates. Utilizing a unique combination of interactive control and the latest technology, EBARA FREX200 provides the perfect combination of speed, accuracy, and flexibility. FREX-200 is capable of grinding and lapping a range of wafers up to 200mm in diameter and up to 50mm thick, making it ideal for wafer fabrication needs. The machine utilizes a variable speed DC motor that provides maximum torque control and can easily handle feed rates up to 200mm/min in both directions, even when faced with heavy substrates or materials. In addition to the high-torque motor, Frex 200 is equipped with an advanced three-axis CNC control to ensure high levels of accuracy for optimal surface consistency. The built-in grinding and lapping module provides an efficient and effective method for grinding and lapping the surface layer and for smoothing the top and bottom surfaces in preparation for polishing. This module utilizes the latest diamond grinding wheels, wire lapping plates, and polishing pads with up to 10 heads and 8 grinding speeds, to provide uniform and smooth surfaces. Additionally, a pressure feedback sensor is integrated into the grinding and lapping module to ensure that pressure is consistently applied during the process. The integrated polishing system of FREX200 utilizes a three-axis approach to polishing and glossing wafers up to a size of 200mm. The module comes with a variety of polishing pads and scratch removal tools, ideal for removing any residual contaminants and ensuring the highest accuracy in surface finish. The automated monitoring unit included with EBARA FREX-200 provides a clear and detailed overview of the machine's overall function and performance. The machine monitors all parameters and visualizes the results in easy-to-read charts, which are displayed both on the unit and remotely via a web interface. This feature provides the user with real-time feedback on the current grinding and polishing operations, allowing for quick and well-informed decisions. In Summary, EBARA F-REX200 is a state-of-the-art wafer grinding, lapping, and polishing tool, equipped with advanced DC motors, CNC control, and a built-in grinding and lapping module. This premium machine provides the user with a high degree of accuracy, along with impressive cutting speeds, allowing for faster and more accurate results in the production of surface-perfect wafers.