Used EBARA Frex 200 #9016976 for sale
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ID: 9016976
Vintage: 2000
Tungsten CMP system
Includes:
Table motor current:
(2) Ceramic tables (heating and cooling capability)
(2) Buff stations
(2) Spare multi-holed top ring head assemblies, Ebara part no. AEPO22-BLR-0010
Main frame construction:
Split frame: cleaning unit and polishing unit
Stainless steel frame, base panels painted light gray, blue, and white
Latched panels and hinged door
Air: flow in transfer / cleaning unit, air-flow in polishing unit
Piping: DI water: PFA / Slurry: PFA and PTFE / Drain: PVC
Loading / Unloading unit: Flouroware, part no. A198-80MB-47C02
Transfer unit: (3) robots
Wafer stations: (2) dry, (2) wet
Polishing unit:
(2) Top-ring units
(2) Turn table units
(2) Dressing units
(1) Rotary transporter units
(1) Slurry feed pump
Rotary transporter unit:
(2) Turnover units
(2) Lifter units
(1) Rotary stage unit
(2) Pusher units
Cleaning units:
(4) Units in total, with in-line processing, process cup structure, and wafer transfer with robot between units
First stage cleaning includes:
Roll sponge scrub cleaning, and chemical spout rinsing for front side and back sides
Peripheral chucking by rollers, and manual damper Ventilation control with exhaust pressure indicator
Second stage cleaning for cleaning both sides of wafer and spin dry, includes:
Pencil sponge scrub cleaning, Megasonic jet cleaning, and chemical spout rinsing
Peripheral chucking by rollers, and manual damper ventilation control with exhaust pressure indicator
Power supply including breaker for each module
Main controller hardware including VME bus, Board computer, Main CPU: 68-series 32-bit O/S software using OS-9/C language description
Separate structure on each module
I/O connection with module, featuring serial communication
Operation unit with touch panel display
Safety measures to include:
Leakage sensors provided on the polishing head (top - ring head)
Drain pans which may have possibilities of fluid leakage
Emergency off buttons installed around the tool to cut power and stop CMP operation
Lift top ring and stop table
Door interlock that stops unit operation
Moving parts are covered with protection covers
Protection cover is provided for areas which may have potential larger than 24 V
208 VAC, 3 phase, 60 Hz
Full load: 80 A
Machine main breaker rating: 125 A
Ampere rating of largest load: 80 A
Interrupt current: 14,000 A
Size of largest motor: 3.7 kW
2000 vintage.
EBARA Frex 200 is a precision wafer grinding, lapping, and polishing equipment designed specifically for the semiconductor industry. The system features advanced control software and is built around a powerful multifunctional robotic unit for efficient and precise wafer processing. The machine also includes a fully automated wafer handling tool that is capable of handling up to 200mm wafers. EBARA FREX200 features an integrated grinding station configured for dual magnetic disc alignment, to ensure the perfect flattening of even the most challenging wafers during the grinding and polishing process. The grinding station is rigged with high pressure coolant for performing fast and accurate grinding with minimized vibrations. The grinding station is also equipped with advanced optical gauges for precise measurements, allowing for precise results. The asset's lapping station is designed to give a perfect finish to the already polished wafer surface. This is done with the help of a fully motorised and integrated lapping arm with high-precision rotary actuators for controlled wafer contact. The advanced control software ensures precise processing and a highly accurate surface finish. FREX-200's polishing station utilises multi-directional pad configurations for efficient wafer polishing. The station automatically adjusts pad pressure settings and employs automated air pressure control for precise results. It also includes automated chemical dispensing systems for better results. The model's advanced software and advanced robotic control equipment enables a fully automated workflow, allowing the operator to monitor and control the entire process remotely. Furthermore, it also features traceable recipe management to ensure repeatable results. Overall, EBARA FREX-200 is a highly advanced precision wafer grinding, lapping, and polishing system, designed to offer the highest possible yields with optimal quality. Its advanced automation features guarantee predictable results, making it the ideal unit for use in the semiconductor industry.
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