Used EBARA Frex 200 #9256130 for sale

EBARA Frex 200 is a wafer grinding, lapping & polishing equipment designed for precision semiconductor applications. It is a high-precision system that offers exceptional repeatability with a wide range of polishing, planarisation and grinding applications in modern semiconductor devices. The unit is perfect for highly accurate wafer grinding and lapping applications, such as for processing of high performance MEMS, MEMS-on-Wafer, and discrete embodiment technologies. It is powered by a servo-controlled drive motor and features a wide range of grinding parameters and is ideal for processors requiring a high level of product consistency. The machine can be adapted for single and/or two-sided wafer processing in order to optimize the grinding and planarization of the wafers. The variable speed motor also provides a wide range of material removal rates ranging from a few microns up to a few millimeters. EBARA FREX200 tool utilizes a two-stage wafer loading asset consisting of a wafer chucking stage and a rotating waferstage. Each wafer stage is independently controlled to allow for different separation and grinding/planarization angles to be accurately and accurately matched in order to perfect the grinding process. The wafer stages also have variable rotation speed and angle settings to accommodate different wafer types. FREX-200 model is capable of operating at temperatures up to 600°C (1100°F) and can provide oxidation-free lapping of ceramic wafers up to 0.2 mm thick and up to 4.0 mm in diameter. It is also equipped with an air jet polishing equipment to allow for a uniform surface finish. The system is also equipped with a high-speed CCD camera to provide exacting real-time monitoring of the entire process for optimal grinding results. In addition, F-REX200 is also designed with safety features including dust extraction, a safety frame, emergency stop bar, and automatic shut-off. The unit's user-friendly graphical interface and robust controller ensure optimal and simple operation. Overall, EBARA F-REX200 Wafer Grinding, Lapping & Polishing is the perfect tool for precise and highly accurate wafer grinding and lapping applications. Its high-precision servo-controlled drive motor, variable speed motor, independent wafer stages, two-stage loading machine, high temperature capability, air jet polishing tool and comprehensive safety features make it the ideal tool for any precision processing requirements.