Used EBARA Frex 200 #9362887 for sale
It looks like this item has already been sold. Check similar products below or contact us and our experienced team will find it for you.
Tap to zoom
Sold
ID: 9362887
Chemical Mechanical Planarization (CMP) system
EFEM:
Load port:
(2) EBARA
(2) TAKA
YASKAWA Robot
Position control: Motor + LM Guide (Harmonic gear)
Wafer transfer:
Wafer station: (2) Transporters
Turn over 1
Turn over 2
(2) Pushers L, R
(2) Lifters L, R
RTP
Polishing unit:
Top ring:
Retainer ring
Head type: MPTI
Head missing
Dresser:
(2) Diamond disks
(2) Air balance types
Table:
(2) Stainless steel materials
(2) Lapping surfaces
(2) KOYO Motors
Rotation: Polisher L, R
Slurry line:
(2) Standards
Option
Roller pump system
L and R polisher missing
Cleaner 1:
Method: (2) Roll scrubs (Upper and lower roller)
Mega sonic: (2) Mega jets (Upper and lower roller)
Wafer roller:
Hardness: (8) Duro90
Cleaner 2:
Method: (2) Pencil + SRD
Bevel sponge: (2) Pencil sponges
(2) SRD Dryers
Operation:
ETC:
Position: Front, L Side, R Side
(3) Touch Monitors, 15"
Option:
End point monitor:
(2) TCM: L Side, R Side
MPM8F Controller
ITM
APC / CLC: BC, FS
Atomizer
Utility:
DIW
(5) Upper exhaust connections
2000 vintage.
EBARA Frex 200 is an advanced wafer grinding, lapping, and polishing equipment designed to produce highly precise and reliable surface finishes on semiconductor wafers. It utilizes sophisticated grinding, lapping, and polishing technology to achieve substrate surface finishes free of defects and particles that can affect device yield. EBARA FREX200 system boasts several advantages over conventional grinding and polishing systems. FREX-200 boasts a high-precision grinding head that utilizes a proprietary synchronized motion mechanism and direct drive motor, which provide superior uniformity and controllability. This enables superior accuracy in the grinding process and higher yields and quality levels in device fabrication. The whole unit is designed for easy setup and operation, with a user-friendly touch panel and intuitive interface. Frex 200 machine also features precision lapping and polishing technology which provides a smoother finish on the substrate than mechanically polishing. The lapping plates are coated with a special polishing slurry which helps to reduce defects and keep the substrate surface uniform, while the polishing head rotates continuously; thus, it delivers a high quality and uniform surface finish. F-REX200 also has an air knife for dust removal, which helps the tool maintain a clean work environment. The asset features a closed-loop control model that helps ensure reproducibility in the grinding, lapping, and polishing processes. It has advanced sensor monitoring and inspection capabilities, with state-of-the-art image processing technology, allowing zero-defect manufacturing. The equipment is also designed with a smart temperature control system that helps maintain consistent temperature during production runs, ensuring a stable manufacturing process and device quality. Overall, FREX200 is a highly advanced and reliable wafer grinding, lapping and polishing unit. It offers exceptional control and uniformity in the grinding, lapping, and polishing processes, allowing users to achieve extremely precise and high-quality device fabrication results. The machine is also highly automated, making it efficient and user-friendly. EBARA FREX-200 is an ideal solution for manufacturers who need a reliable and precise tool to ensure quality and high yields in device production.
There are no reviews yet