Used EBARA Frex 200M2 #293744971 for sale

EBARA Frex 200M2 is a wafer grinding, lapping and polishing equipment that allows operators to achieve extremely precise flat, smooth surfaces on large silicon wafers. This system uses the latest cutting-edge technology to ensure that the surface roughness achieved during grinding and polishing is consistently optimal. The unit is equipped with multiple wafer grinding head attachments that are capable of grinding wafers with sizes ranging from 4" to 8" depending on the application. The machine also features an automated wafer lapping plate that uses a precise combination of rotation, crossing and repeating user-controlled motions to ensure uniform processing of all surfaces. The versatile Frex 200M2 also features a variable speed control which allows operators to fine tune the grinding and polishing processes to optimize surface characteristics and achieve the best results. This can be especially beneficial for material removal applications due to the ability to reduce wear and tear on consumables. EBARA Frex 200M2 also provides users with a user-friendly interface for controlling many of the most important processes. This includes a convenient electro-magnetic chucking process and a user-friendly automated control tool. The asset's intuitive user interface displays both historical and current data to help users identify problems and correct them quickly and efficiently. Frex 200M2 has a built-in state-of-the-art safety model designed to ensure optimum safety for operators. This equipment uses a combination of warning lights and audible alarms to alert operators to any potential safety issues. This system also features an emergency stop feature that can be used to quickly shut down the entire unit in the event of an emergency. EBARA Frex 200M2 is an advanced wafer grinding, lapping and polishing machine designed to provide users with an optimal level of accuracy, precision and reliability. With its versatile head attachment, variable speed control and intuitive user interface, Frex 200M2 ensures precision grinding and lapping of wafers, enabling operators to achieve the desired surface characteristics for critical applications.