Used EBARA Frex 300 #293597723 for sale

EBARA Frex 300 is an advanced wafer grinding, lapping, and polishing system that provides superior performance and reliability. EBARA FREX-300 utilizes a three-stage process to achieve the highest possible levels of surface smoothing with minimal damage to the substrate. The first step of the wafer grinding, lapping, and polishing process is grinding. This involves using a wheel to grind the wafer surface down to the desired size and shape. The second step is lapping, which uses an abrasive slurry to flatten and smooth out any residual imperfections after the grinding process. The final step is polishing, which provides an even finer level of smoothing and surface finishing. F-REX300 is designed with a wide range of features to accommodate a variety of applications. It can be used with a variety of wheel diameters and abrasive sizes to provide precision and accuracy. The adjustable grinding depth and contact pressure ensures that the desired surface finish is achieved consistently and with minimal wafer damage. The system also includes a full range of controls, including a programmable control panel, wheel speed and direction control, and a variety of safety shut off systems to ensure that no damage is done to the workpiece. Frex 300 can also be customized to accommodate specific application requirements. The high-performance FREX-300 is capable of producing both fine and rough surfaces. It is ideal for applications in semiconductor and solar technology, as well as wafer thinning and wafer grinding. Its superior performance ensures that EBARA F-REX 300 can handle any type of wafer grinding, lapping, and polishing with ease.