Used EBARA Frex 300 #293606132 for sale
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ID: 293606132
Wafer Size: 12"
Vintage: 2001
CMP System, 12"
EFEM (Load/Unload):
(4) ASYST Load ports
YASKAWA Electric robot
Position control: Motor + Ball screw
Dry robot
Wafer transfer:
(2) Turn overs (R/L Side)
(2) Pushers (R/L Side)
(4) LTP Linear stages (R/L Side)
(2) Lifters (R/L Side)
Wafer stage (R/L Side)
Wet robot
Polishers:
(2) Top ring normal heads
(2) Buffing tables
Slurry line
Chemical (CL) connection
Return Line
(2) Dressers (R/L Side):
Diamond pattern type
Disk type: Plate
(2) Tables (R/L Side):
Material stainless steel
Lapping surface
Motor
(2) Cleaners:
1st Cleaner:
(2) Roll scrubs
(2) Megasonics
Wafer roller: Duro 90
SC-1 < 60°C
2nd Cleaner (Pencil and SRD Unit):
(2) Roll scrubs
Megasonic
Power control unit:
Power control
(4) Drivers:
Head rotation
Head swing
Operation controller (ETC):
Hardware:
VME Bus, board computer
Main CPU: 68 Series 32 Bit
2001 vintage.
EBARA Frex 300 is an advanced wafer grinding, lapping and polishing equipment. It is designed to produce single-sided and/or double-sided polished wafers with tight control on the surface roughness, surface flatness and thickness. The system provides excellent controllability when performing ultra-precise grinding, lapping or polishing operations. EBARA FREX-300 features an advanced digital control unit that enables precise control of the grinding, lapping, or polishing process during operation. It includes a high-power Sony spindle motor that offers smooth, low-vibration and high-speed rotation, helping to ensure uniform results. The machine also features advanced air bearing which allows for smooth, vibration-free grinding, lapping or polishing operations. F-REX300 operates on a six-axis robotic motion tool with a three-axis stage module. The robust robotic asset provides precise and repeatable automated grinding, lapping, or polishing operations for repeatable results. The robotic motion model is fully enclosed to enhance process control and safety. The equipment includes integrated software components that can be used to customize the grinding, lapping, or polishing operations. The integrated software enables easy and fast customization of grinding parameters. It also has an intuitive user interface which makes it easy to control and monitor the system operations. In addition, the software includes a data storage unit that enables users to store data from past grinding and/or polishing operations for later review. The machine is equipped with a wide range of grinding, lapping and polishing consumables. The consumables are designed to provide consistent and repeatable results. The grinding tools are made from a variety of materials for different operations such as rough grinding, fine grinding, lapping and polishing.Lapping and polishing tools are made from resilient materials like ceramic and polycrystalline diamond, ensuring uniform results. EBARA F-REX300 also features two different application-specific components: an optional abrasive storage cassette, and a polishing cassette. The abrasive cassette is designed for easy loading and unloading of grinding materials. The polishing cassette is designed to provide uniform application of the polishing agents allowing for accurate, repeatable results. Frex 300 is a highly capable wafer grinding, lapping and polishing tool designed to provide precise control of the wafer grinding, lapping, and polishing processes. It features an advanced digital control asset, high-power Sony spindle motor, air bearing and robotic motion model, integrated software components, and a range of grinding, lapping and polishing consumables. The two application-specific cassettes make it easy to load and unload grinding materials and polishing agents, providing consistent and repeatable results.
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