Used EBARA Frex 300 #293636556 for sale

ID: 293636556
Wafer Size: 12"
Vintage: 2004
CMP System, 12" Wafer station (3) Handling robots (2) Polishing units (2) Linear transporters (3) Filters Base material: Silicon Diameter: 300 ± 0.2 mm 2004 vintage.
EBARA Frex 300 Wafer Grinding, Lapping & Polishing system is an automated and versatile platform with advanced features that enables precision grinding, lapping and polishing of semiconductor wafers. EBARA FREX-300 has been designed to provide flexibility and fast turnaround times, while delivering the highest level of wafer surface quality. At the heart of F-REX300 is its high-speed, high-accuracy spindle and base unit. The integrated, high-resolution CCD camera ensures precise control over spindle position and surface quality. The motor-driven spindle has programmable speeds from 1,000 to 6,000 RPM, allowing the operator to make smooth, accurate adjustments throughout the entire grinding and lapping cycle. Additionally, the spindle offers a range of standard tooling for grinding, lapping and polishing, and can also be configured for custom applications. EBARA F-REX300's advanced control system tracks and records all parameters associated with the grinding and lapping process, allowing users to review any error or data points that may have occurred during the process. This ensures that the same results will be achieved each and every time, without manual intervention. Process optimization is enabled through FREX-300's innovative Mechano-Justiable Components, which allow the operator to customize the machine's process parameters even further. Additionally, F-REX 300 has been designed to accommodate different stages of the polishing process, such as chemical mechanical planarization (CMP). This ensures that each step of the polishing process is achieved with consistent results every time. EBARA F-REX 300 is capable of handling a wide range of wafer sizes, from 75mm-200mm or larger, and has a processing area of 400x250mm. Its small footprint allows for a significant reduction in floor space requirements. All of these features combine to make Frex 300 an ideal solution for high-yield production of precision wafer devices.
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