Used EBARA Frex 300 #293641964 for sale

EBARA Frex 300 Wafer Grinding, Lapping and Polishing Equipment is an automated system for polishing and grinding a variety of wafer materials. The unit includes an A6k-XP high speed spindle, with a maximum speed of 60,000 RPM, and is equipped with two axes for grinding and polishing. The wafer grinder is capable of sub-micron accuracy for precision grinding and is loaded with features to improve efficiency and component quality. This includes a vacuum unit, air-cooled spindle, belt grinding, optional track auto loading and unloading capability, itemized real-time component information, water temperature control and timer. EBARA FREX-300 is designed to effectively process both 200mm and 300mm diameter wafers, multi-material wafer types, and both hard and sticky substrates. It is equipped with adjustable carpet and polishing pads to accommodate sample sizes larger than the wafer diameter size. The high-speed spindle ensures a fast yet highly precise grinding process, while thebelt machine ensures a fast and efficient material transfer. Furthermore, the optional autoload/unload feature allows quick component loading and unloading of multiple wafers without manual intervention, which increases productivity and reduces labor costs. The tool includes a high-precision CCD sensor to detect component edge position and thus optimize the grinding and polishing process. The variable speed spindle can reduce component damage, since it can adjust speeds to accommodate different wafer materials and thicknesses. The control unit is equipped with a graphical user interface for the easy management and monitoring of the asset. The built-in temperature control model reduces thermal abrasion and protects the wafers from overheating. F-REX300 Wafer Grinding, Lapping, and Polishing Equipment is a well-designed system that can accurately and efficiently process a wide range of materials and substrate sizes. Its precise CCD edge detection sensor and variable speed spindle give the unit the ability to achieve high-precision results and reduce component damage. Its optional autoload/unload features and graphical user interface make the machine ideal for production automation and laboratory applications.