Used EBARA Frex 300 #293707331 for sale

EBARA Frex 300 is a powerful wafer grinding, lapping and polishing equipment designed to produce extremely precise flat surfaces on a variety of semi-conductor wafers, including Si, SiC, and GaAs. The system features dual grinding heads which can process up to 12-inch wafers with rapid feedrates of up to 0.1µm/s. EBARA FREX-300 is equipped with a precision alignment unit to ensure optimal leveling and higher yields. The Frex has a vacuum-mounted main grinding spindle which allows for flexibility in the movements of the dual grinding heads for superior wafer quality and an improved surface finish. The machine also employs a dynamic water cooling tool and integrated laser interferometer to monitor the depth of cut and the flatness of the wafer. The grinding head of F-REX300 is equipped with powerful servomotors which are capable of driving the heads with a peak velocity of 30m/min. These motors provide superior wafer positioning accuracy of +/-25µm, allowing for precision grinding and polishing. FREX-300 is equipped with an intelligent control asset and touch-screen to enable easy and intuitive operation. The model also includes a data management equipment and a user-friendly touch-screen interface. This allows the user to store process parameters and log data for statistical process control. F-REX 300 is a highly durable and reliable system, designed for precision and long-term use in a variety of applications. The unit is compliant with SEMI standards for wafer processing and is designed for the highest level of accuracy and repeatability. With its exceptional performance, Frex 300 is the ideal machine for wafer grinding, lapping and polishing in advanced semiconductor device fabrication.