Used EBARA Frex 300 #293761442 for sale

EBARA Frex 300
ID: 293761442
Wafer Size: 12"
CMP Systems, 12" Missing part: HDD.
EBARA Frex 300 wafer grinding, lapping & polishing equipment is an all-in-one processing solution for advanced semiconductor fabrication. This state-of the-art system is capable of multi-axis motions to enable high precision grinding, lapping and polishing of wafers up to 300mm in diameter. A developed turreted spindle inside the machine reduces turbulence and creates precise movements throughout the operation, guaranteeing high yield accuracy and a superior finish. Within the unit, a flat, single sided grinding wheel is used to precision grind wafers in order to ensure consistent profile, geometry and size. The manipulator in the machine ensures stability and repeatability for each wafer. A built-in water cooling tool is used to keep the parts cooled down during the operation, thus reducing thermal stresses. A wide range of grinding wheels, laps and polishes can be used and quickly changed during job programming, allowing for maximum flexibility. Lapping is conducted using pre-programmed rotating lap mates referred to as "platters", which contain abrasive material to produce superior flatness. The polishing station sets the final step for attaining a smooth and mirror-like surface finish. After the operation, the asset automatically carries out a quality control procedure, to inspect and verify the sample. This is done by comparing the data with the stored standard to ensure that all the parameters are within acceptable limits. EBARA FREX-300 features a highly intuitive graphical user interface with an ergonomic design. The user can easily select settings and program jobs with minimal effort. With its robust design, maintenance is minimal and cable-less connections allow for quick and easy setup. The model's self-diagnostic feature ensures that all components are functioning properly, allowing the operator to monitor the equipment's performance and optimize it for the job at hand. F-REX300 is an ideal system for high accuracy grinding, lapping and polishing of wafers up to 300mm in size. It combines accuracy, flexibility and reliability with an intuitive user interface, allowing efficient and precise operations.
There are no reviews yet