Used EBARA Frex 300 #293816722 for sale

EBARA Frex 300 is a state-of-the-art, highly automated wafer grinding, lapping and polishing equipment. The sophisticated 3-axis automation system on EBARA FREX-300 ensures precise and consistent results within a single lot of wafers for as many wafers as you need. F-REX300's Grinder and Lapper both incorporate a unique three-axis mechanical release mechanism which eliminates the need for manual handling and other manual processes. EBARA F-REX300's grinder has a maximum grinding speed of up to 95,000 rpm, a minimum size of 40nm and a high-precision resolution at ±20nm, making it the perfect choice for process and R&D requirements. The polishing unit on EBARA F-REX 300 has been designed to handle very fine wafers and can generate high-grade surface finishes with quality control. The polished wafers can reach roughness of Ra 2.5 nm and flatness of a few Angstroms. The high-precision, automated mirror polishing machine in FREX-300 ensures consistent and high-performance results. The tool also includes a standard flat-lapping process which offers fast, repeatable and high-quality lapping results with flatness capabilities of below 0.1 nm (0.3 nm local flatness). There is an optional pre-turn asset to support high-end lapping, which allows for improved roundness accuracy. The integrated cleaning model ensures that all components of the equipment are clean and free from particles before each process. F-REX 300 is also equipped with a post-process inspection module for wafer quality control. Frex 300 is designed with an advanced dust-laden, dust-free version to meet the requirements of cleanroom friendly operations. The system is also compliant with SEMI standards, which makes it suitable for high-volume production. In conclusion, EBARA Frex 300 is an ideal unit for automated precision grinding, lapping and polishing of high-grade wafers. It offers high-precision results, repeatable performance and low defect rates.