Used EBARA Frex 300 #9008491 for sale

EBARA Frex 300 is a professional wafer grinding, lapping, and polishing equipment. It is designed to handle the most challenging wafer precision surface processing applications with a combination of advanced grinding, lapping, and polishing capabilities. The system utilizes a patented, multi-axis modular unit that allows the user to customize their wafer processing machine to be tailored to their specific needs. EBARA FREX-300 tool is configured with a robust spindle drive with up to three-axis simultaneous movement and grinding, lapping, and polishing operations that can accommodate up to 200mm wafers. It uses an advanced array of fixtures, tools, and algorithms that allow for faster and more efficient machining. It also features a comprehensive measurements package that can be used to conduct a number of analytical tasks related to wafer processing. F-REX300 also features a suite of powerful diamond grinding wheels and other tools that provide an efficient and precise processing of wafers. The asset uses a unique, high-grade cooling model to ensure consistent performance and prevent overheating during the grinding, lapping, and polishing operations. Additionally, a range of specialized polishes are available that out-perform traditional polishes in terms of surface quality. Furthermore, the equipment is equipped an advanced process control package that enables the system to precisely control and monitor the grinding, lapping, and polishing operations. This allows for consistent and high-quality performance and minimal wastage. Additionally, an optional advanced process visualization unit is available to visualize and analyze the machining process. F-REX 300 wafer grinding, lapping, and polishing machine is a powerful, advanced tool that is ideal for processing the most challenging wafer surfaces. It is designed to make wafer processing faster, more efficient, and more cost-effective, which makes it a great choice for precision wafer processing operations.