Used EBARA Frex 300 #9017351 for sale
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ID: 9017351
Wafer Size: 12"
Vintage: 2004
Poly / STI CMP system, 12"
Factory Interface (FI):
Frame config: metro ready
Load-port type: (4) Asyst ISO
Pre-aligner
Wafer handling robot: track type with dual end effecter
Polisher (L/R):
Process (L/R): STI
Polishing heads: 300 mm AL head, gen. II
Endpoint: TCM and friction
Platen type (speed): ceramic (SIC), 10-150 rpm
Pad type: IC1000
Platen pad conditioner: scan dresser 4” disc (3M 5122-AB), sweep driven
Slurry delivery: closed loop (CLC) delivery
Slurry flow range: 25-250 mL/min (low flow rate)
Slurry line 1: HS-8800
Slurry line 2: none
Slurry line 3: none
Wafer slip-out sensor: yes
Wafer loss camera: no
Platen cooling flow monitor: Tokyo KEISO
Platen cooling temp monitor: user configurable alarm settings
Dresser DIW flow meter: flow range 1.0-1.5 L/min
Atomizer: yes
Endpoint (L/R):
Table current monitor (TCM): yes
Multi-process monitor ME20 for EPD: yes
Metrology option: none
Cleaner (L/R):
Cleaner 1 type: roller brush
¬ Note: no megasonic
¬ Chem. delivery type: (1) chem CLC 0.0-1.0 L/min (alarm capability)
¬ Chemical 1 upper flow meter: 0.0-1.0 L/min
¬ Chemical 1 lower flow meter: 0.0-1.0 L/min
¬ Chemical line 1: HF
¬ Chemical line 2: n/a
¬ Bevel edge cleaning: yes
Spin rinse dryer: pencil brush
¬ Chem delivery type: (1) chem CLC 0.0-1.0 L/min (alarm capability)
Options:
Robot D: Yaskawa
Robot R: Yaskawa
Robot L: Yaskawa
Status lamp (RYGB, front/rear)
Monitor 1: front
Monitor 2: L-side
Monitor 3: R-side
EPD monitor: R-side
Software:
Main SW ver: 7.5.02
CPU-1 (OS/9) ver: 7.5.02
CPU-2 (OS/9) ver: 7.5.00
Touch panel control ver: 7.5.00
Touch panel drawing ver: 7.5.00
Online ver: 7.5.00
ME10/ME20 ver: 2.4.30.0
Communication:
Controller (logic): VME
Controller (process database): touch panel
Heat exchanger / chiller:
(1) Advanced Thermal Sciences SX-21
Facility:
Seismic support: bracket locations to be provided
Chemical connections: bottom
Exhaust connections: top
Gas connections: bottom
Drain connections: bottom
Power requirements: 208 VAC (3.4 kW) , 200 A, 3 phase, 3 wire+ground, 60 Hz
2004 vintage.
EBARA Frex 300 is a wafer grinding, lapping and polishing equipment that is capable of achieving superior results at high production rates. This automated system is designed to run wafers up to 300 mm in diameter, efficiently and reliably producing superior results with an accuracy of 1 micron or less. The unit utilises material removal techniques to achieve the highest levels of surface finish. It can simultaneously process a number of substrates and has built-in process parameters for a wide variety of wafers. The machine is controlled by a Graphical User Interface (GUI) which facilitates easy operation and adjustment. When used in conjunction with ELID (electrolytic in-process dressing) grinding, EBARA FREX-300 is capable of achieving high removal rates on many types of substrate. This process utilises a stationary diamond grinding wheel to remove material and then a non-rotating abrasive pad to level and finish the workpiece. This results in an improved level of surface flatness when compared to conventional grinding methods. F-REX300 is equipped with an automated spindle changer, allowing quick transition between different wafers and different processes. This tool uses a wide range of grinding spindles and tools to meet the needs of various production requirements. The spindle changer is programmable and is able to move from one operation to the next quickly and accurately. The asset has a self-diagnostic model to check for any errors, and a visual alarm for help to quickly identify any issues. The built-in safety measures are designed to protect the equipment from damage and ensure that no damage is done to the wafers. FREX-300 is also designed to be energy-efficient and is capable of achieving significant energy savings through the use of efficient motors and advanced control systems. Overall, EBARA F-REX300 is an advanced wafer grinding, lapping and polishing system capable of producing superior results with excellent accuracy and repeatability. This unit is an ideal choice for high-volume applications and provides users with an efficient, reliable and cost-effective solution to their production needs.
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