Used EBARA Frex 300 #9044488 for sale

EBARA Frex 300 is a high-precision wafer grinding, lapping, and polishing equipment designed for the semiconductor industry. This machine offers both mechanical and chemical polishing capacities that provide superior surface finishing and planarization ofwork pieces. EBARA FREX-300 is an automated system with full SPC and FDC capabilities. It utilizes an 8-axis motion control unit that allows for rapid and precision surface grinding, lapping, and polishing processes. The machine can be flexibly configured for either batch production processes or in-line production lines. The machine utilizes a patented wafer suspension tool that securely holds the wafers during the grinding and polishing processes. F-REX300 is equipped with a high-power drive head that can handle wafers up to 300mm, and is capable of grinding and polishing on both sides with grits as fine as 800G. It includes a high precision polishing pad that ensures a superior polished surface finish. EBARA F-REX 300 is designed for high-precision and smooth process results at high cycle rates. It has several safety features, including debris traps and opto-sensor systems for accurate and repeatable results. The machine is driven by a Linux-based CNC computer and allows for full automation of the wafer processing process. F-REX 300 is also equipped with a vacuum chuck for reliable and repeatable wafer loading and positioning. The asset is designed to handle a wide variety of wafer materials, including silicon, gallium arsenide, and diamond. It is also engineered to provide low equipment maintenance and service costs. Additionally, Frex 300 is Eco Mark certified, and meets all necessary environmental and safety standards. FREX-300 is an integrated wafer grinding, lapping, and polishing solution that combines speed, precision, and flexibility into a single, powerful machine. With its superior surface finishings and planarizations, EBARA F-REX300 is a top choice for semiconductor industry production needs.