Used EBARA Frex 300 #9120543 for sale

EBARA Frex 300 is a specialized manufacturing equipment designed for efficient wafer grinding, lapping, and polishing processes. This system is best suited for precision wafer finishing or post-polishing applications as it can process any size or type of wafer with high processing yields and repeatable accuracy. EBARA FREX-300 includes a unique three-axis lapping and polishing table for wafers. The table allows for grinding and lapping operations in the series X, Y, and Z axes, with vertical, horizontal, and depth of cut controls. The table is fully enclosed and constructed of stainless steel, providing superior durability and performance. An adjustable air roller enables efficient material removal and particle removal during processing, while the optional vibratory drive eliminates tedious and labor intensive manual wheel grinding operations. Additionally, F-REX300 includes a programmable multi-axis grinding wheel head that allows for speed, direction, and wheel position control. This wheel is adjustable and reversible for optimal grinding results and maximum productivity. The head is mounted on a linear slide for smoother wheel traversal and improved surface finish. The polishing module is also equipped with a programmable multi-axis flat lapping wheel head. This wheel allows for variable rotational and linear speeds, as well as variable depth of cut and direction. The wheel is enclosed in a water-cooled stainless-steel housing for minimal abrasive wear and extended life. The polishing module also includes an adjustable lapping chuck for variable wafer grinding and polishing angles. Finally, the unit includes a built-in wafer cleaning module which controls the pressure, rotation and duration of the cleaning process. This module can be integrated with the Frex's grinding and polishing modules, providing improved operating efficiency. The robust features of Frex 300 makes it the ideal machine for high-precision wafer grinding, lapping, and polishing operations. Its adjustable, multi-axis grinding wheel heads and linear slide provide exceptional control and accuracy. The versatile cleaning module ensures superior wafer cleanliness and surface preparation, while the user friendly controls simplify significant time savings. With its versatile feature set, this machine is well-suited for post-polishing operations in both the semiconductor and optoelectronic industries.