Used EBARA Frex 300 #9142699 for sale

EBARA Frex 300 is a precision wafer grinding and polishing equipment that is designed for a wide range of processing requirements. This system utilizes an oscillating motion mechanism that allows for highly efficient grinding and polishing of wafers. The design is capable of providing a repeat accuracy of less than 1 micron. The unit also features a fully variable speed control from 0 to 60 RPM. EBARA FREX-300 is suitable for various wafer types and sizes, ranging from 200mm to 300mm. It is designed to be able to process a range of materials such as Si, GaAs, GaN, GaSb, InP, InSb, and silicon carbide (SiC). It is also compatible with various grinding wheels and different materials for polishing, such as diamond slurries, polishing pads, lapping film, and micro-abrasives. F-REX300 is equipped with a powerful variable frequency drive, and a stepped-down unit to maintain the maximum torque at all RPMs. This machine ensures a consistent and effective grinding process and also prevents overstressing the wafer. It includes a variable speed hydraulic tool for quick and accurate wafer positioning. The asset also features an output for controlling an external cooling model. F-REX 300 has a frame geometry designed to minimize vibration and maintain wafer surface flatness. This equipment is equipped with a substrate holder, lapping head, and grinding arm for efficient grinding and lapping of wafers. It is designed with several safety features, such as an integrated E-stop to quickly stop the machinery, should any issue arise. Overall, EBARA F-REX300 is a reliable and efficient wafer grinding, lapping, and polishing system for precision wafer processings. It is capable of efficiently processing a variety of wafer sizes and materials with a repeat accuracy of less than 1 micron. Additionally, the unit is designed with several safety features to ensure a safe operating environment.