Used EBARA Frex 300 #9163556 for sale
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ID: 9163556
Wafer Size: 12"
Vintage: 2001
CMP System, 12"
Process (W): Tungsten
Load- port
Polisher R/L
Cleaner
Dryer
Does not include Hard Disk Drive (HDD)
2001 vintage.
EBARA Frex 300 is an automated wafer grinding, lapping and polishing equipment produced by EBARA Corporation. It is a bench top machine designed for handling smaller wafer sizes, enabling customers to take advantage of advanced abrasion process technology from EBARA Group. EBARA FREX-300 can grind, lap, and polish even heat-sensitive and difficult-to-handle wafers with superior surface finish and minimal deformation. F-REX300 features a tabletop design equipped with a robotic arm for high speed and precise operation. The arm can tilt from the base to obtain the best grinding angles for a variety of materials and wafer sizes. F-REX 300 also includes a load lock chamber that maintains atmospheric pressure and prevents contamination during the process. The grinding process takes place within a sealed stainless steel container that utilizes precision-controlled abrasive slurry to grind the surface of the wafer to the desired surface finish. Both the slurry feed and the rotational speed of the grinding pad are adjustable, allowing for versatile grinding and polishing strategies. Additionally, the top cover of the grinding bed can be easily closed and mounted with several vacuum fittings. This helps to create a safe environment while maximizing surface finish quality. The lapping process is done within a closed loop system where the lapping surface is precisely controlled. The unit has the ability to grade wafers according to the surface finish after the lapping process. By using fluid control, the lapping process can achieve single or dual-sided wafer polishing as well as multiple lapping cycles. The polish process is performed with adjustable fluid supply and dosing. Frex 300 designed a polish chamber that is sealed to prevent any contamination during the polishing process. It can also be operated with or without a vacuum to remove any unwanted particles from the surface. EBARA F-REX 300 is an ideal machine for wafer grinding, lapping and polishing that provides superior surface finish and minimal deformation. It enables customers to take advantage of advanced abrasion process technology from the innovative EBARA Corporation.
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