Used EBARA Frex 300 #9182740 for sale
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ID: 9182740
Wafer Size: 12"
CMP System, 12"
Components:
(1) Loadport (Foup): 1
(1) Loadport (Foup): 2
(1) Loadport (Foup): 3
(1) Loadport (Foup): 4
(1) Mainbody: Load unload unit
(1) Mainbody: Cleaner unit
(1) Mainbody: Polish unit: L
(1) Mainbody: Polish unit: R
(1) TCM & Noba monitor unit
(1) DHF Supply unit
(1) Power supply unit
(1) SC-1 Supply unit
(1) Slurry delivery unit
(1) Parts box: 1
(1) Parts box: 2
(1) Parts box: 3
(1) Parts box: 4
(1) Poli head: R
(1) Poli head: L
(1) Dresser: R
(1) Dresser: L
(1) Punching jig
(1) Poli jig
(1) Foot plates
(1) Cable pallet: 1
(1) Cable pallet: 2
(1) Cable pallet: 3
(1) Pipe: 1
(1) Pipe: 2
(1) Pipe: 3
(1) Pipe: 4
(1) Pipe: 5
(1) Roller tool
(1) Upside panel: 1
(1) Upside panel: 2
(1) Upside panel: 3
(1) Upside panel: 4
(1) Upside panel: 5
(1) Upside panel: 6
(1) Upside panel: 7
(1) Upside panel: 8
(1) Backside panel: 1
(1) Backside panel: 2
(1) Backside panel: 3
(1) Backside panel: 4
(1) Backside panel: 5
(1) Poli panel: 1
(1) Poli panel: 2
(1) Poli panel: 3
(1) Poli panel: 4
Parts box 1:
(1) Fitting jig
(1) Poli L,R Docking bolt
(1) Clean & poli docking bolt
(1) Poli L,R Shutter cover
(1) Poli & clean L,R Side cover
(1) Poli L,R Cooling water 1,2
(1) Poli L,R drain
(1) CL1 R-Side drain
(1) CL1 L-Side drain
(1) Poli L,R Side drain 1,2
(1) CL Drain pan drain
(1) CL R Side drain pan drain
(1) CL2 R Side drain
(1) CL2 L Side drain
(1) CL & EFEM Docking bolt
(1) CL 1,2 L Side
Parts box 2:
(2) Exhaust pipe
(1) Road cell
Parts box 3:
(1) Special jig
(1) Diar gage jig
(1) Pad jig
(2) Use the drive for the lift shaft
(1) Centol ling jig
(1) M6-11
(1) Sfc003610
(1) Sfc003615
(1) Position fixture
(1) 70735401
(1) C-6200-192
(9) Other parts
Parts box 4:
(1) Side panel-L braket
(1) Side Panel-R braket
(1) Side panel-L
(1) Side panel-R.
EBARA Frex 300 is a semiconductor wafer grinding, lapping and polishing equipment built for controlled backside processing on wafers up to 6" in diameter. The system is equipped with a 320 mm main grinding wheel, single-axis servo drive units, and two 6" vacuum chucks. Its unique grinding process utilizes a diamond abrasive wheel that is capable of modulating the process factors such as cutting depth, feed rate, and density to achieve excellent planarization on the wafer. The unit employs a unique grinding wheel design with abutment milling technique that provides uniform contact force across the wafer, leading to efficient grinding times. The lapping process is controlled by a direct drive machine which accurately synchronizes the two 6" vacuum chucks. It features a low-vibration loop drive tool with a closed loop automatic servo motor control that optimizes the lapping process based on the sample size. The lapping process produces a high-quality surface finish with a controlled surface texture, providing excellent planarity and feature definition. Finally, the polishing process is carried out on EBARA FREX-300's polishing wheel, which is driven by an ECU-controlled DC servo motor. It is capable of providing accurate pressure control and dynamic performance for specific wafer surfaces. In summary, F-REX300 is a powerful wafer grinding, lapping, and polishing asset that offers excellent planarity and feature definition. It features reliable performance and accuracy, thanks to its low-vibration loop drive model, ECU-controlled DC servo motor, and diamond abrasive wheel. The equipment is designed to meet the demands of high precision semiconductor wafer manufacturing industry.
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