Used EBARA Frex 300 #9224087 for sale
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ID: 9224087
Wafer Size: 12"
Vintage: 2004
CMP System, 12"
Factory interface (FI)
Frame config: Metro
Polisher (L/R):
Polishing heads: 300mm AL Head, Gen. II
Endpoint: TCM & Friction
Platen type: Ceramic (SIC)
Platen speed: 10-150 RPM
Platen pad conditioner:
Scan dresser disc, 4”
Sweep driven
Slurry delivery: CLC Delivery
Slurry line 1: ASAHI 25-250 ml/min (Low flow rate)
Platen cooling flow monitor: TOKYO KEISO
Platen cooling temp monitor: User configurable alarm settings
Dresser DIW flow meter: Flow range 1.0-1.5 L/min
Atomizer
Cleaner:
Cleaner 1 type: Roller brush
Chemical delivery type: Chemical CLC 0.0-1.0 L/min (Alarm capability)
Chemical 1 Upper flow meter: 0.0-1.0 L/min
Chemical 1 Lower flow meter: 0.0-1.0 L/min
Spin rinse drier: Pencil brush
Chemical delivery type: Chemical CLC 0.0-1.0 L/min (Alarm capability)
Options:
Robot D / R / L: YASKAWA
Status lamp (RYGB, Front / Rear)
Monitor 1: Front
Monitor 2: Left side
Monitor 3: Right side
EPD Monitor: Right side
Communication:
Controller (Logic): VME
Controller (Process database): Touch panel
Hard disk not included
2004 vintage.
EBARA Frex 300 is a wafer grinding, lapping and polishing equipment that is used for the production of thin, flat wafers for the electronics industry. The system operates using advanced CNC technology to precisely control the grinding, lapping and polishing processes. The first step in the process is the grinding of the wafer, which is performed with a lap wheel. The lap wheel is driven by a high-precision stepper motor, which allows for extremely precise grinding levels. The second step is the lapping of the wafer, which is done with a ball bearing lapping plate. The speed and pressure of the lapping process is controlled by a sophisticated servo-control unit, which ensures the desired outcome is achieved with optimal quality. The third and final step is the polishing of the wafer, which is done with a diamond polishing pad. The diamond polishing pad is driven by a brushless DC motor, which allows for a semi-automated polishing process. The motor is designed to improve the process efficiency and provide a high-quality finish. The machine is equipped with a vision tool, which is used to check the shape and finish of the wafer. The vision asset is integrated with a precision CNC motion control model, which allows for extremely precise manipulation of the wafer. The CNC equipment is also capable of adjusting the speed of the grinding, lapping, and polishing processes to ensure the desired results are achieved. EBARA FREX-300 is designed to operate safely, efficiently and with minimal operator intervention. The system is equipped with several safety features, such as electronically interlocked doors, emergency stop buttons, and sophisticated machine monitoring systems. The unit is also equipped with a range of features to ensure optimal performance, such as high-precision stepper motors, powerful brushless DC motors, and precision CNC motion control systems. F-REX300 also features a user-friendly graphical user interface, which allows operators to easily adjust and fine-tune the settings according to their needs.
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