Used EBARA Frex 300 #9384035 for sale

ID: 9384035
Wafer Size: 12"
Vintage: 2002
CMP System, 12" Missing parts 2002 vintage.
EBARA Frex 300 is a precision and cost-effective wafer grinding, lapping & polishing equipment developed for mass production processing of semiconductor wafers and other thin wafers. This machine is specially designed to offer high-speed grinding in minimum space. EBARA FREX-300 is suitable for producing ultra-smooth, defect-free surfaces on a variety of materials such as Si, SiC, GaAs and other types of thin wafers. The core of the system is its advanced grinding, lapping & polishing process which ensures fast and uniform wafer polishing. This process consists of three sequential stages; namely grinding, lapping and polishing. During the grinding stage, the abrasive particles are subjected to high-speed rotation for removing material in nanometric increments. During lapping stage, the abrasive particles are again subjected to high-speed rotation in combination with precise pressure, allowing for even minimal material removal and surface flattening. The polishing stage then involves the application of abrasive particles along with appropriate pressure and material removal in order to form a highly polished surface. F-REX300 also features an advanced modular design for easy maintenance; which allows customers to customize their systems for specific applications. The machine is equipped with a high accuracy CNC spindle for machining tools for grinding operations. The machine also features a temperature sensitive air bearing which provides accurate machining with high speed and precision. The operation of EBARA F-REX 300 is further enhanced with its automated load and unload mechanism, pressure adjustment and CCD inspection. The machine also features a User Interface, allowing for complete monitoring and control of the process, displaying all the functions of the unit. Overall, F-REX 300 is a powerful wafer grinding, lapping & polishing machine designed for fast, cost-effective and efficient machining of thin wafers. Its advanced grinding, lapping & polishing technology, coupled with its advanced design features ensures a superior and precise surface finish on a variety of materials.
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