Used EBARA Frex 300 #9384469 for sale

EBARA Frex 300 is an efficient yet cost-effective, wafer grinding, lapping and polishing equipment for use in semiconductor fabrication processes. EBARA FREX-300 can be configured for all stages of grinding, lapping and polishing of both full wafers and stripped slices. F-REX300 boasts a quick tool change system and an ability to accommodate multiple wafer sizes. The grinding stage of F-REX 300 utilizes fine, precise diamond grinding belts capable of grinding wafers with precise surface flatness. The abrasive belts provide an excellent surface preparation step for further lapping and polishing operations. The belt grinding station also features an integral coolant delivery unit to ensure optimum grinding results. Next, EBARA F-REX300's lapping stage utilizes a unique high-performance cast iron lap plate along with abrasive particles, which provide quick lapping times and exceptional step heights. The lapping operation is equipped with an adjustable pressure claw which guarantee maximum surface flatness for advancing to the polishing operation. The final stage of EBARA F-REX 300 is the polishing process, where a variety of polishing slurries can be used to obtain exceptionally high surface flatness with less than 1nm in depth of defects. The polishing method is an industry-standard technique, where an adjustable, rotary pressure head is used to manipulate the slurry over the wafer. Frex 300 brings numerous benefits to the semiconductor fabrication industry. Its unique static and dynamic platen designs provide an efficient and cost-effective grinding, lapping and polishing process in a single machine, reducing process time and cost while maintaining high quality results. The ability to accommodate multiple wafer sizes increases its efficiency, and flexible configurations make it easy to use in different stages of the semiconductor fabrication workflow.