Used EBARA Frex 300 #9384477 for sale

EBARA Frex 300 is a wafer grinding, lapping and polishing equipment designed for critical 300mm wafer grinding, lapping and polishing on all materials including silicon, gallium arsenide and quartz wafers. EBARA FREX-300 is easy to use and is equipped with the latest advancements in automated wafer preparation technologies. F-REX300 features a fully automated wafer processing system, which ensures quick and accurate wafer preparation. It is equipped with a powerful grinding, lapping and polishing module capable of producing highly precise surface finishes on wafers. It utilizes high-precision spindles that rotate at high speeds for the grinding, lapping and polishing process. Additionally, F-REX 300 is equipped with a variable grinding direction unit which allows for efficient material removal. With the variable grinding direction machine, EBARA F-REX 300 can easily process circular and non-circular wafers alike. FREX-300 is also equipped with auto-sensing and auto-cycling features. The auto-sensing feature works by detecting the type of wafer being processed as well as its size and thickness. This ensures that the wafer will be processed within the optimal parameters based on its specific characteristics. The auto-cycling feature allows for the accurate and efficient transfer of wafers from the wafer loading carriage to the grinding, lapping and polishing chamber, and vice versa. Frex 300 is designed for maximum productivity and efficiency. It is capable of processing large and small wafers in the same process cycle. It can process multiple wafers at one time and up to 10 wafers per cycle. Additionally, EBARA F-REX300 is designed for low wear, reduce maintenance, and extended service life. In terms of safety, EBARA Frex 300 features a level 5 safety tool for wafer handling and processing. Moreover, the asset is equipped with ergonomically designed trays that makes it user-friendly. This prevents any potential harm from handling the wafers manually during the loading and unloading process. Overall, EBARA FREX-300 is a highly reliable and efficient wafer grinding, lapping and polishing model. It is designed for single wafer and multiple wafer processing, while also enabling high precision and accuracy. The features of F-REX300 make it a perfect solution for high-volume wafer production.