Used EBARA Frex 300 #9390393 for sale

EBARA Frex 300 is an advanced wafer grinding, lapping, and polishing equipment that is designed to perform defect-free, high precision, and high uniformity wafer preparation. The system's innovative technologies offer a combination of precision grinding, low-damage wafer conditioning for enhanced surface uniformity, and simple integration to other processing steps. By utilizing a suite of advanced process controls and adaptive boundary control techniques, this unit will greatly reduce the total cycle time of wafer conditioning processes. EBARA FREX-300 is equipped with a 0.25µm single-axis stage, closed loop control, three-point support, advanced vacuum machine, and more. This enables high-precision and high-accuracy surface polishing, while also providing improved wafer off-line placement and process repeatability. Furthermore, the tool can be automated for multi-step processes using its adaptive grinding, lapping and polishing modules. The asset's main components include a grinding and lapping head, a polishing head, two manual and two motorized rotational stages, a polishing film, a platen, and a polishing solution. By combining the grinding and polishing heads with the two manual and two motorized rotational stages, the model can apply the polishing film, platen, and polish solution to the wafer at the same time. This minimizes total cycle time and ensures even, high-accuracy, high-precision conditioning. F-REX300 also features a unique adaptive boundary-control module. This module effectively reduces the total cycle time by dynamically adjusting the limits of the grinding, lapping, and polishing windows in accordance with wafer-processing conditions. This ensures low-damage wafer conditioning, high process repeatability and reliable wafer off-line placement. The equipment can be integrated into a variety of industrial processes such as etching, resist removal, coating and lithography. All these processes can be easily implemented using Frex 300. Furthermore, the adaptive boundary-control module can be software programmed to control process boundaries, providing the user with complete automated process automation. EBARA F-REX300 is an advanced wafer grinding, lapping, and polishing system that is designed to provide high precision and excellent surface uniformity, while still providing process automation. Its adaptive boundary-control module reduces both cycle time and process difficulty, while further optimizing wafer conditioning. From adjusting process limits to controlling multiple processes, FREX-300 is an excellent tool for users looking for industry-leading and reliable results.