Used EBARA Frex 300e #293742057 for sale

EBARA Frex 300e is an automated high-precision wafer grinding, lapping and polishing equipment designed to provide superior surface finish, flatness and dimensional accuracy for a variety of substrates in the semiconductor, MEMS and LED device industries. The system combines a highest-level of grinding accuracy with lapping and polishing capabilities to deliver the required precision for a variety of critical device components. The unique feature of Frex 300e is its advanced "multi-step" process that eliminates grinding wheel marks and ensures a smooth finish. The preferential grinding process can also be used to fabricate lapped wafers directly from grinding with no lapping grades, if desired. The lapping and polishing stages of EBARA Frex 300e are independently controlled by two sets of motor controls, allowing simultaneous and independent control of the grinding and polishing cycles. The polishing stage is capable of both flat and surface grinding. The Grinding/Lapping/Polishing Unit is equipped with a 3-axis programmable table, which allows for wafer grinding, lapping and polishing operations without the need for manual operation. The 3-axis table covers a wide range of working area (10mm-150mm). The online GCP machine allows Frex 300e to monitor and adjust parameters in real-time, enabling the user to optimize the grinding/lapping/polishing process for each wafer fabrication job. In order to provide a superior precision surface finish, the machine incorporates a special diamond grinding wheel to achieve superior surface finish with minimal grinding. The diamond grinding wheel is specially designed to offer a consistent and uniform grit profile on the surface of the device. EBARA Frex 300e utilizes a propriety multistep lapping process to achieve dimensionally and optically accurate surfaces within tight tolerances. The tool also incorporates a liquid cooled grinding/lapping/polishing mechanism with a digital PID temperature control asset. This allows the machine to offer superior cooling effect and faster grinding/lapping/polishing speeds for identical processing time. The design architecture of the model is also designed to allow for easy upgrade and customization, so users can keep up with the latest technologies and trends in the semiconductor and device industries. Overall, Frex 300e is an automated high-precision wafer grinding, lapping and polishing equipment that combines advanced grinding accuracy with lapping and polishing capabilities to deliver the required precision for any wafer manufacturing job. The system is equipped with a wide array of features and functions that allow users to achieve superior precision with minimal time, effort and cost.