Used EBARA Frex 300e #293821657 for sale

EBARA Frex 300e is a high-precision wafer grinding, lapping, and polishing equipment designed for semiconductor device fabrication and precision deprocessing applications. The system offers wafer preparation from blanket wafers for manual or automated processing with a unique 6-axis motion control unit in a compact, small footprint. The machine is designed with a 3-Step grinding, lapping and polishing process. The first step involves wafer grinding with a proprietary grinding wheel, allowing a fine-grained surface finish. The second step is a lapping process, with an automated diamond slurry distribution mechanism. The third step is a polishing process treated with ultra-fine diamond powders, for obtaining a defect-free surface finish. In addition, Frex 300e tool is designed with an advanced Motion Control algorithm, allowing a higher degree of accuracy and a repeatable grinding, lapping and polishing process. This advanced algorithm is also suitable for automated wafer loading/unloading. Additionally, the asset allows a wide range of wafer grinding, lapping and polishing including the preparation of ultra-smooth surfaces on high k dielectric materials. For safety and maintenance purposes, the model incorporates a PLC (Programmable Logic Controller) equipment, allowing for remote control through an Ethernet interface. This enables convenient control and monitoring of the entire process from a central computer. EBARA Frex 300e system also offers a range of features for improved process repeatability and control, including an integrated temperature controller unit for constant temperature monitoring during the grinding lapping and polishing process, for improved material properties. The machine also offers a real-time 3D visualization tool which provides visual feedback of the wafer during the lapping and polishing process, helping to ensure precise grinding and gain the highest process yield. Overall, Frex 300e is a high-precision wafer grinding, lapping, and polishing asset designed for semiconductor device fabrication and precision deprocessing applications. With its advanced Motion Control algorithm, wide range of wafer preparation options, temperature control and 3D visualization capabilities, the model will ensure increased process performance and improved yields.