Used EBARA Frex 300S #293591998 for sale

EBARA Frex 300S
ID: 293591998
Wafer Size: 12"
Vintage: 2006
CMP Systems, 12" Function control test 2006 vintage.
EBARA Frex 300S is a wafer grinding, lapping and polishing equipment, designed for precision machining of ceramic and crystal materials. It provides reliable and repeatable results in short processing times, making it an ideal production system for high volume manufacturing of advanced components. The unit features a modular construction, which enables it to be configured to meet the specific requirements of any given application. The main components include a wafer carrier, a turntable, two lapping plates, a polishing pad, and a servo-controlled drive machine. The wafer carrier is designed to hold and position wafers securely during the grinding and lapping processes. It is equipped with a heat-resistant protective sheet for extra protection when grinding materials with high thermal expansion. Additionally, it has a robust design to ensure that it remains effective during long production runs. The turntable is responsible for rotating the wafer as it is ground and lapped. It consists of a powerful motor which is connected to a drive belt, enabling the turntable to rotate at speeds ranging from 0.7 to 2000 rpm. The turntable can be adjusted to accommodate the size of the wafer and provide uniform motion during machining. The two lapping plates are designed to grind and lap the wafer. The lapping plates are available in various materials, so that they can be suited to the material being machined. The plates are made from a high grade aluminium alloy and can withstand high pressures up to 35MPa. The polishing pad is used to polish the wafer material to a fine finish. It consists of a smooth, scratch resistant surface that can accept large loads and provide a high-gloss finish. Finally, the servo-controlled drive tool provides precise control over the machining process, ensuring that the machining parameters are within the desired accuracy level. The asset also includes a servo-controlled temperature compensation model, which automatically adjusts the operating parameters in response to the material's temperature. In summary, EBARA FREX300S is a versatile and reliable wafer grinding, lapping and polishing equipment, designed to provide precise and repeatable results in short processing times. It has a modular construction, making it suitable for a wide range of applications, and is equipped with a robust mechanical architecture for long-term reliability.
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