Used EBARA Frex 300S #293592001 for sale

EBARA Frex 300S
ID: 293592001
Vintage: 2005
CMP System 2005 vintage.
EBARA Frex 300S is a technologically advanced wafer grinding, lapping and polishing equipment designed to meet the high precision needs of the semiconductor industry. The system is ideal for producing high-precision lapped, finely polished and extremely flat silicon wafers. The unit features a unique three-axis linear motor stage and an integrated, CNC motion-controlled spindle. This advanced combination allows EBARA FREX300S to grind, lap and polish wafers with high accuracy and repeatability. The machine also features a high-precision, force-controlled long stroke spindle designed to reduce flutter and increase the speed, accuracy and repeatability of the motion control. In addition to its precision motor stage, F-REX300S features a flexible, modular design to ensure efficient processing. The tool employs a variety of available processing modules that enable the production of wafers with a variety of high-precision surface finishes. The superior spindle design coupled with the three-axis configuration allows for longer processing times and better overall surface flatness. EBARA FREX-300S also offers a flexible lapping and polishing solution for a variety of substrates. The asset's versatile processing capabilities allow for lapping and polishing processes to be tailored to any application. The compatible range of consumables, specialized processes and available process parameters provides the user with an effective and efficient solution for any application. A variety of safety features make FREX-300 S an ideal solution for demanding semiconductor processing applications. The model is fully compliant with strict safety standards, ensuring that the equipment is safe and reliable. An integrated safety system & monitor unit also monitor machine performance and alert the user to any potential problems. In summary, FREX300S is a technologically advanced wafer grinding, lapping & polishing tool that offers high-precision performance for demanding semiconductor lapping and polishing applications. The asset's unique three-axis linear motor stage and integrated, CNC motion-controlled spindle enable the model to achieve exceptionally accurate and repeatable results. The flexible, modular design and a range of process parameters and consumables ensure that the user can tailor the equipment to suit any application. Along with safety features that ensure safe and reliable operation, EBARA F REX 300 S is an ideal platform for demanding lapping and polishing applications.
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