Used EBARA Frex 300S #9095701 for sale

EBARA Frex 300S is a high-precision wafer grinding, lapping, and polishing system designed to ensure production of ultra-smooth, defect-free surfaces on layered semiconductor wafers. It is manufactured with a series of modules, including Grinder, Lapper, Polisher, and Water Soluble Grinding Aid, to provide a complete range of machining options for both wet and dry processing. The Grinder module uses advanced engineering solutions, such as a regulated spindle with motor torque control, and a high-precision stepped gearbox, to achieve optimized and repeatable grinding processes on a wide variety of materials. It is also thermally protected, ensuring repeatable and reliable performance. The Lapper module uses an oscillating table drive and fine-grained abrasive material to produce uniform and clean wafer surfaces. The Polisher module increases the surface finish of the wafers by removing any defects or irregularities found on the surface with a polishing pad. The Water Soluble Grinding Aid module helps reduce the time and costs associated with the repeated cleaning and maintenance of grinding and lapping machines through the use of a water-soluble paste. EBARA FREX300S is equipped with advanced testing solutions such as non-contact displacement and displacement transducers, as well as process sensors, to ensure accurate and predictable results. It is CE marked and UL listed, and is capable of operating with a variety of power supplies, including the Japan-universal (JPN) and South Korea-universal (KOR) models. It has a user-friendly graphical user interface (GUI), making it easy to program and control by an operator. F-REX300S is an ideal choice for semiconductor manufacturing facilities that require precision and reliability. Its modular design, advanced engineering solutions, and user-friendly interface make it an appealing choice for manufacturers looking for an efficient and reliable wafer grinding, lapping, and polishing system.