Used EBARA Frex 300S #9137374 for sale

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EBARA Frex 300S
Sold
ID: 9137374
Wafer Size: 12"
Vintage: 2005
System, 12" EFEM: (3) Asyst load ports Dry robot (4) Topring Dresser: (4) Disk type: Paradium coating (4) Holder type: SEASOL (Magnetic) (4) Type: Scan disk Table: (4) Material: Stainless steel (4) Surfaces: Lapping (4) YASKAWA Motors Power supply: 3 Phase 2005 vintage.
EBARA Frex 300S is an automated wafer grinding, lapping, and polishing equipment designed for use in microelectronic device fabrication. The system is geared towards applications such as semiconductor device polishing, including MEMS, sensors, and optical components utilized in a variety of industries. EBARA FREX300S offers precise control through automated processes that can yield superior surface finishes, critical dimensions, and greater repeatability. F-REX300S features a frame made from 4-pillar design linear motor driven table with a precise positioning drive for the wafer. It is equipped with a powerful 45DFC-S polishing motor and has a controlled grinding and polishing process with parameters for wafer loading and unloading. It has a grinding accuracy at the level of a few micrometers and can grind and lap from 2 to 8 inches. Frex 300S is capable of multiple grinding and polishing modes such as rotary grinding, free grinding, diamond grinding, and low-force polishing. It comes with several custom grinding and polishing attachments, such as recessed faces, multi-layers, diamond based lapping, and electroplated roll lapping. Its in-process control unit allows operators to view wafer finishes in real-time and monitor parameters such as hydraulic force, rpm, and polishing time. FREX-300 S is user-friendly, as all operations, processes, and adjustments can be carried out via its intuitive graphical touch screen interface. It is equipped with a data acquisition and analysis machine, allowing for better control of processes and improved part tracking and documentation. With Procios technology, the tool is capable of multi-tasking applications, allowing for simultaneous grinding, polishing, and inspecting of up to 10 wafers at a time. FREX300S is an advanced and efficient wafer grinding, lapping, and polishing asset that offers superior outcome quality as well as user convenience. With its automated and programmable features, advanced technologies, and intuitive control model, this equipment can effectively and reliably produce superior wafer components for a variety of industries.
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