Used EBARA Frex 300S #9235714 for sale

EBARA Frex 300S is a wafer grinding, lapping and polishing equipment that is specifically designed for processing ultra-thin (less than 0.5mm or 20 mil) wafers and thin films. The system utilizes a three-axis, computer-controlled grinding and polishing spindle that can be configured with up to four grinding heads at once, as well as a dual-axis lapping head, making it a highly versatile unit for multiple applications. EBARA FREX300S also offers a range of options, such as additional grinding heads, lapping heads, and a dedicated polishing head, perfect for adapting the machine to a specific application. F-REX300S features a rigid and rigid-cast construction design, which allows for consistent and precise processing at high speeds. This is further aided by its fully automatic wafer handling tool, which handles wafer alignment, loading, and unloading for maximum accuracy, efficiency and repeatability. The asset also offers a wide range of grinding and polishing media, from silicon carbide to diamond and from 3 to 100 μm abrasives, providing flexible options to meet specific requirements. The model is equipped with high-precision servo motor control and digital data feedback, which enables stable and accurate grinding and polishing results at the highest speed. It is also equipped with a reliable cooling equipment, which helps to optimize the grinding and polishing process. Lastly, FREX-300S has a user-friendly interface and modular layout, making it an ideal choice for any wafer grinding and polishing application in the semiconductor, MEMS and optics industries.