Used EBARA Frex 300S #9235789 for sale

EBARA Frex 300S is a wafer grinding, lapping, and polishing equipment with a wide range of applications in the semiconductor and optoelectronic industries. This high precision system is designed for efficient and precise fabrication of semiconductor devices on the nanoscale. EBARA FREX300S has a 300mm wafer capacity, low-profile design, and dual-head grinding and lapping capability. It is equipped with an open-air automatic wafer loading unit, as well as a clean room-ready spin dryer machine, allowing for quick turnaround of wafers. Additionally, the tool features a high-accuracy AC servo motor for precision surface grinding and lapping. The cutting and grinding is done using diamond implements with selectable kinematics. The lapping process uses smooth, fast, and precise motion to produce a highly uniform and defect-free surface finish. The lapping is done using either diamond abrasive or conventional metal lapping plates, careful consideration is taken to avoid over-lapping of wafers and trenches. The asset also features a high accuracy wafer thickness measurement model to ensure precise and consistent grinding results. F-REX300S is designed to be highly energy efficient while also producing high-quality workpieces. The precise grinding and lapping process produces minimal heat and dust, and thus allows for low total operating costs. The equipment is also designed to be highly effective in producing parts with tight geometric tolerances and uniform surface finishes. In conclusion, EBARA FREX 300 S is a highly precise, energy efficient, and cost-effective choice for grinding, lapping, and polishing of semiconductor and optoelectronic components. Its dual-head capabilities, precision motoring, and superior surface finishes make it ideal for fabrication of high-end and complex components in the industry.